Team:ETH Zurich/lab/chip

From 2014.igem.org

(Difference between revisions)
(PDMS Chip Preparation)
(3D-Printing and Rapid Prototyping)
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All fabricated structures were ready to use after removing the support structures and did not require additional surface treatments like sonication, curing, painting or silanization. The molds were then directly used for PDMS chip production. In addition, custom made black 96-well plates (connected wells for diffusion assays, plate reader compatible) were printed but found to be leaky over time. The material costs of the molds were in the range of US$2 to US$4 and for the 96-well plates below US$8 (about US$160 per kg of ABS). The maximum resistance to continuous heat is given as 90 degrees Celsius<sup>[[Team:ETH_Zurich/project/references#refCRC|[23]]]</sup>, as a result autoclaving at 121 degrees Celsius was not feasible (see picture below).
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All fabricated structures were ready to use after removing the support structures and did not require additional surface treatments like sonication, curing, painting or silanization. The molds were then directly used for PDMS chip production. In addition, custom made black 96-well plates (connected wells for diffusion assays, plate reader compatible) were printed but found to be leaky over time. The material costs of the molds were in the range of US$2 to US$4 and for the 96-well plates below US$8 (about US$160 per kg of ABS). The maximum resistance to continuous heat is given as 90 degrees Celsius<sup>[[Team:ETH_Zurich/project/references#refCRC|[23]]]</sup>, as a result autoclaving at 121 degrees Celsius was not feasible (see picture 5a).

Revision as of 18:37, 17 October 2014

iGEM ETH Zurich 2014