Team:EPF Lausanne/Microfluidics/Making/PartI
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+ | <li class="active"><span>Making a chip Part I: mask and wafer</span></li> | ||
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+ | <h2 id="introductiontophotoresist">Introduction to photolithography</h2> | ||
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The following processes will explain how a mask and a positive/negative resist wafer are made. These two components are essential for the creation of our chips, as they are the master plan, the mold for the chip. This is how it works: a mask is used as a mold to make a wafer, and a wafer is used as a mold to make each of the microfluidic chip's layers (control and flow layers).</p> | The following processes will explain how a mask and a positive/negative resist wafer are made. These two components are essential for the creation of our chips, as they are the master plan, the mold for the chip. This is how it works: a mask is used as a mold to make a wafer, and a wafer is used as a mold to make each of the microfluidic chip's layers (control and flow layers).</p> | ||
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- | <a href="https://static.igem.org/mediawiki/2014/ | + | <p>Mask</p> |
+ | <a href="https://static.igem.org/mediawiki/2014/a/a8/Mask.JPG" data-lightbox="image1" data-title="Mask (to make wafer)"><img src="https://static.igem.org/mediawiki/2014/a/a8/Mask.JPG" class="img-border" width="35%"></a> | ||
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+ | <p>Wafers</p> | ||
+ | <a href="https://static.igem.org/mediawiki/2014/9/9f/Wafers.JPG" data-lightbox="image1" data-title="Wafers (to make the chip)"><img src="https://static.igem.org/mediawiki/2014/9/9f/Wafers.JPG" class="img-border" width="35%"></a> | ||
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<p class="lead">Here are defined the two main types of photoresist. A photoresist is a light-sensitive material used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface:</p> | <p class="lead">Here are defined the two main types of photoresist. A photoresist is a light-sensitive material used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface:</p> | ||
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<td><b>Hard bake</b></td> | <td><b>Hard bake</b></td> | ||
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DataPlate </td> | DataPlate </td> | ||
<td class="cntr"><img src="https://static.igem.org/mediawiki/2014/f/f5/Cl6.png" /><br /> | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/f/f5/Cl6.png" /><br /> | ||
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+ | <a href="https://2014.igem.org/Team:EPF_Lausanne/Microfluidics/Designing" class="btn btn-primary pull-left" role="button"><- Designing a chip</a> | ||
+ | |||
+ | <a href="https://2014.igem.org/Team:EPF_Lausanne/Microfluidics/Making/PartII" class="btn btn-primary pull-right" role="button">Next step: Making a chip part II -></a> | ||
+ | <div class="clearfix"></div> | ||
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+ | </div> | ||
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+ | <li class="active"><a href="#introductiontophotoresist">Introduction</a></li> | ||
+ | <li><a href="#processoutline">Mask process and outline</a></li> | ||
+ | <li><a href="#controllayer">Control layer process outline</a></li> | ||
+ | <li><a href="#flowlayer">Flow layer process outline</a></li> | ||
+ | </ul> | ||
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Latest revision as of 01:24, 18 October 2014
Introduction to photolithography
The following processes will explain how a mask and a positive/negative resist wafer are made. These two components are essential for the creation of our chips, as they are the master plan, the mold for the chip. This is how it works: a mask is used as a mold to make a wafer, and a wafer is used as a mold to make each of the microfluidic chip's layers (control and flow layers).
Here are defined the two main types of photoresist. A photoresist is a light-sensitive material used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface:
- A negative resist is a type of photoresist in which the portion of the photoresist that is exposed to light crosslinks and thus becomes insoluble to the photoresist developer. The unexposed portion of the photoresist is dissolved by the photoresist developer.
- A positive resist is a type of photoresist in which the portion of the photoresist that is exposed to light becomes soluble to the photoresist developer. The portion of the photoresist that is unexposed remains insoluble to the photoresist developer.