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Team:EPF Lausanne/Microfluidics/Making/PartI
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<td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | ||
Bake 135°C 2 hours, using an oven | Bake 135°C 2 hours, using an oven | ||
| + | </td> | ||
| + | </tr> | ||
| + | </tbody> | ||
| + | </table> | ||
| + | |||
| + | |||
| + | |||
| + | <h3>Flow layer process outline</h3> | ||
| + | <table class="table table-striped valign-middle"> | ||
| + | <thead> | ||
| + | <tr> | ||
| + | <th>Step</th> | ||
| + | <th>Process description</th> | ||
| + | <th>Machines</th> | ||
| + | <th>Cross-section after process</th> | ||
| + | </tr> | ||
| + | </thead> | ||
| + | <tbody> | ||
| + | <tr> | ||
| + | <td><b>01</b></td> | ||
| + | <td><b>Substrate:</b> Si test Priming</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | YES III</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/d/d8/Cr_blank_fab1.gif" /><br /> | ||
| + | Dehydrate and prime with HMDS, using the oven to create hydrophobic surface on the wafer, to prepare the wafer for coating</td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>02</b></td> | ||
| + | <td><b>Photolith:</b> Resist deposition | ||
| + | Photo Resist : AZ9260 – 14μm | ||
| + | </td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | EVG 150</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | ||
| + | A layer of positive photoresist is added on the wafer by spincoating</td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>03</b></td> | ||
| + | <td><b>Rehydratation time</b></td> | ||
| + | <td class="cntr"></td> | ||
| + | <td class="cntr">Wait minimum 1 hour, maximum 3 days | ||
| + | </td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>04</b></td> | ||
| + | <td><b>Photolith:</b>UV exposure</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | Mask Aligner</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | ||
| + | The UV lights are exposed through the Mask on the surface of the wafer. By doing so, it imprints the pattern of the design on the PR. | ||
| + | </td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>05</b></td> | ||
| + | <td><b>Develop immediately</b></td> | ||
| + | <td class="cntr"></td> | ||
| + | <td class="cntr">Wait maximum 1 hour before develop | ||
| + | </td> | ||
| + | </tr> | ||
| + | <tr> | ||
| + | <td><b>06</b></td> | ||
| + | <td><b>Photolith:</b> Develop</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | EVG 150</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | ||
| + | This removes the exposed photoresist from the wafer using chemical treatment with the EVG 150 | ||
| + | </td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>07</b></td> | ||
| + | <td><b>Rinse with Deionized water</b></td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | Coillard Wetbench</td> | ||
| + | <td class="cntr">Rinse wafers in Quick Dump Rinse then in Ultra Clean bath, using wetbench | ||
| + | </td> | ||
| + | </tr> | ||
| + | |||
| + | <tr> | ||
| + | <td><b>08</b></td> | ||
| + | <td><b>Bake to round edges</b></td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/8/81/DWL200_intro.jpg" /><br /> | ||
| + | DataPlate</td> | ||
| + | <td class="cntr"><img src="https://static.igem.org/mediawiki/2014/9/9e/Cr_blank_fab2.gif" /><br /> | ||
| + | Bake in horizontal position, 160°C 2 hours | ||
</td> | </td> | ||
</tr> | </tr> | ||
Revision as of 18:06, 9 October 2014
Mask process and outline
| Step | Process description | Machines | Cross-section after process |
|---|---|---|---|
| 01 |  Cross section of a photolithography mask |
||
| 02 | Laser exposure |  Heidelberg DWL200, Laser lithography system |
 The laser beams on the surface of the photoresist. By doing so, it imprints the pattern of the design on the PR. |
| 03 | Developing of the mask | DV10 Mask and Thick positive resist developer |
A chemical treatment is used to remove the PR that was exposed by the laser in the previous step, creating the ‘holes’ on the photoresist |
| 04 | Etching of the chrome | Coillard Gravure |
The chrome is removed at the sites where the resist layer is missing, using an acid bath. |
| 05 | Removal of Resist | Coillard Photolithographie |
Once the chrome is removed at the precise sites (previous step), the rest of the resist is removed from the whole surface. |
| 06 | Use of mask | The mask can now be used to expose its pattern on the wafer using UV light |
Control Layer Process outline
| Step | Process description | Machines | Cross-section after process |
|---|---|---|---|
| 01 | Substrate: Wafer Clean | Tepla 300 |
Clean the wafer using plasma treatment |
| 02 | Photolith: Resist deposition Photo Resist : Su8 GM1070 – 30μm | Sawatec |
A layer of negative photoresist is added on the wafer by spincoating |
| 03 | Relaxation time + Softbake | Sawatec |
Softbake wafer using Sawatec hotplate, to solidify the photo resist |
| 04 | Photolith:UV exposure | Mask Aligner |
The UV lights are exposed through the Mask on the surface of the wafer. By doing so, it imprints the pattern of the design on the PR. |
| 05 | Post exposure bake | Sawatec |
Bake wafer using Sawatec hotplate |
| 06 | Relaxation delay | Wait 1 hour – overnight | |
| 07 | Photolith: Develop | Wetbench plane solvent |
This removes the unexposed photoresist from the wafer using chemical treatment on a wet bench |
| 08 | Hard bake | DataPlate |
Bake 135°C 2 hours, using an oven |
Flow layer process outline
| Step | Process description | Machines | Cross-section after process |
|---|---|---|---|
| 01 | Substrate: Si test Priming | YES III |
Dehydrate and prime with HMDS, using the oven to create hydrophobic surface on the wafer, to prepare the wafer for coating |
| 02 | Photolith: Resist deposition Photo Resist : AZ9260 – 14μm | EVG 150 |
A layer of positive photoresist is added on the wafer by spincoating |
| 03 | Rehydratation time | Wait minimum 1 hour, maximum 3 days | |
| 04 | Photolith:UV exposure | Mask Aligner |
The UV lights are exposed through the Mask on the surface of the wafer. By doing so, it imprints the pattern of the design on the PR. |
| 05 | Develop immediately | Wait maximum 1 hour before develop | |
| 06 | Photolith: Develop | EVG 150 |
This removes the exposed photoresist from the wafer using chemical treatment with the EVG 150 |
| 07 | Rinse with Deionized water | Coillard Wetbench |
Rinse wafers in Quick Dump Rinse then in Ultra Clean bath, using wetbench |
| 08 | Bake to round edges | DataPlate |
Bake in horizontal position, 160°C 2 hours |
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