Team:EPF Lausanne/Microfluidics/Making/PartII
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Revision as of 23:37, 11 October 2014
Chip manufacturing
The chip creation procedure is divided into several steps. These steps are summarized in the figure above. First one needs to create a mask (see c) in order to obtain a master (see d) starting from a silicon wafer (see a). For the specific procedure of mask and wafer creation, see Part I. Once the master is ready it can be used as a mold to create the PDMS chip.
Here is a non-exhaustive step by step presentation. For the precise procedure you can refer to our notebook protocol.